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yl6809永利官网学术论坛 第75期

发布日期:2016-06-17 点击数:

yl6809永利官网学术论坛

(第75期)

主题

Finding Solutions to Thermal Problems

主讲人

李日(Sunny Li), Assistant Professor, University of British Columbia

时间

2016年06月20日(周一)上午10:00

地点

东配楼四层报告厅(山东大学千佛山校区)

嘉宾及内容简介

嘉宾简介:

Dr. Sunny Li received his MASc and PhD degrees from the University of Toronto. Before joining the University of British Columbia, he worked as a research scientist at GE Global Research, NY, USA. He is a registered Professional Engineer with the Association of Professional Engineers and Geoscientists of BC. Dr. Li is an expert of thermal management and electronics cooling. His research also focuses on multiphase flows such as sprays, atomization, and droplet dynamics. His research was funded or in collaboration with DARPA (Defense Advanced Research Projects Agency, USA) and DOE (Department of Energy, USA), GE Aviation, GE Energy, and Xerox. Dr. Li mainly published in journals such as Physics of Fluids, Journal of Heat Transfer, Physical Review E, AIChE Journal, and Langmuir.

内容简介:

Thermal issues are ubiquitous in many engineering applications. Researchers and engineers in the field of thermal engineering need to find solutions to many thermal problems in components, devices, systems, and processes. This has particular importance for the electronics industry, where the continued advance in electronics has generated increasingly challenging thermal issues due to the rising number of devices packaged in tightened space. This has led to increasing demand for effective cooling solutions capable of dissipating enormous amounts of heat through small areas and keeping active devices within their operating temperature ranges.

A few research and development projects related to the thermal management and electronics cooling will be presented. The ideas and solutions for addressing varied thermal problems will be discussed. The cooling methods include passive cooling, active air and liquid cooling, which are suitable for handling varied heat fluxes. Additionally, the heat transfer involved in the icing of water droplets on surfaces will be discussed.

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